BSCCO-2212 thick films on a flexible YSZ substrate

✍ Scribed by Shu-jan Chen; Sushil Patel; Eiki Narumi; David T. Shaw; Dell St. Julien; Thomas D. Ketcham

• Publisher: Elsevier Science
• Year: 1993
• Tongue: English
• Weight: 524 KB
• Volume: 218
• Category: Article
• ISSN: 0921-4534
• DOI: 10.1016/0921-4534(93)90282-u

✦ Synopsis

The potential use of flexible YSZ as a substrate material for the partial-melt growth, PMG, of Bi-2212 thick films was studied. Results show low critical temperatures, To, ( < 50 K) and degradation in the flexibility of the YSZ due to inter-diffusion. The Tc was significantly improved ( > 80 K) when Ag was used as a buffer layer. The optimum peak processing temperatures were found to decrease with increasing buffer-layer thickness. The critical current density, J~, also improved with increasing buffer-layer thickness. The self-field Jc of these Bi-2212/Ag/YSZ composites was 1-3 × 103 A/cm 2 at 20 K, significantly lower than that for the Bi-2212/Ag tapes. However, the present study strongly supports the viability of using flexible YSZ with an appropriate buffer in the wind-and-react fabrication of high-To pancake coils. The mierostructure and transport properties of Bi-2212/YSZ and Bi-2212/Ag/YSZ composite structures will be discussed.