Broadband parametric representation of packaged MEMS interconnects using a state space spectral model
✍ Scribed by K. Naishadham; J. Muldavin; J. E. Piou
- Publisher
- John Wiley and Sons
- Year
- 2008
- Tongue
- English
- Weight
- 233 KB
- Volume
- 50
- Category
- Article
- ISSN
- 0895-2477
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✦ Synopsis
Abstract
This article presents a robust measurement‐based spectral model, derived from an all‐pole state‐space system representation of the scattering parameters, for the broadband characterization of low‐loss packaged MEMS circuits. The proposed method is illustrated by extracting distributed transmission line parameters of a MEMS interconnect, which accounts for discontinuities and package‐specific parasitic effects. It is shown that the state space method (SSM) effectively filters out measurement noise and facilitates extraction of frequency‐dependent parameters. © 2008 Wiley Periodicals, Inc. Microwave Opt Technol Lett 50: 1482–1485, 2008; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.23402