Bottom-Up Fill of Copper in Deep Submicrometer Holes by Electroless Plating

✍ Scribed by Shingubara, Shoso; Wang, Zengling; Yaegashi, Osamu; Obata, Ryo; Sakaue, Hiroyuki; Takahagi, Takayuki

• Book ID: 121410296
• Publisher: The Electrochemical Society
• Year: 2004
• Tongue: English
• Weight: 267 KB
• Volume: 7
• Category: Article
• ISSN: 1099-0062
• DOI: 10.1149/1.1707029