Bottom-up copper electroplating using transfer wafers for fabrication of high aspect-ratio through-silicon-vias

✍ Scribed by Chongshen Song; Zheyao Wang; Litian Liu

• Publisher: Elsevier Science
• Year: 2010
• Tongue: English
• Weight: 450 KB
• Volume: 87
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/j.mee.2009.06.029