Bonding wire characterization using automatic deformability measurement

✍ Scribed by C.J. Hang; I. Lum; J. Lee; M. Mayer; C.Q. Wang; Y. Zhou; S.J. Hong; S.M. Lee

• Book ID: 104051986
• Publisher: Elsevier Science
• Year: 2008
• Tongue: English
• Weight: 507 KB
• Volume: 85
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/j.mee.2008.05.008