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Bonding Low-density Nanoporous Metal Foams Using Sputtered Solder

✍ Scribed by M. J. Bono; O. Cervantes; C. M. Akaba; A. V. Hamza; R. J. Foreman; N. E. Teslich


Publisher
John Wiley and Sons
Year
2008
Tongue
English
Weight
221 KB
Volume
10
Category
Article
ISSN
1438-1656

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