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Bonding in the ternary copper tin phosphide Cu4SnP10

✍ Scribed by D.W. Bullett; W.G. Dawson

Book ID: 100001250
Publisher: Elsevier Science
Year: 1986
Tongue: English
Weight: 228 KB
Volume: 60
Category: Article
ISSN: 0038-1098
DOI: 10.1016/0038-1098(86)90439-4

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