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Bonding at Cu-Al interfaces: Relevance to microcircuit packaging

✍ Scribed by Stephen R. Cain; Charles G. Woychik

Publisher: Elsevier Science
Year: 1992
Tongue: English
Weight: 739 KB
Volume: 53
Category: Article
ISSN: 0022-3697
DOI: 10.1016/0022-3697(92)90053-g

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