Bidirectional sealing blowout preventer

• Publisher: Elsevier Science
• Year: 2003
• Tongue: English
• Weight: 135 KB
• Volume: 2003
• Category: Article
• ISSN: 1350-4789
• DOI: 10.1016/s1350-4789(03)04023-6

✦ Synopsis

Applicant: Epcos AG, Germany

This invention relates to a method for hermetically encapsulating an electronic component that is mounted in flip-chip design on a support. The method described is characterized by first covering the component with a film, which closely rests on the component and the support, then structuring the film, and providing a hermetic sealing layer, especially a metal layer, which creates a seal with the support.