Beurteilung von Loten und Lötverbindungen unter dem Einfluss steigender Kupfergehalte in verunreinigten bleifreien Lotbädern
✍ Scribed by B. Wielage; D. Weber; Th. Lampke
- Publisher
- John Wiley and Sons
- Year
- 2008
- Tongue
- English
- Weight
- 660 KB
- Volume
- 39
- Category
- Article
- ISSN
- 0933-5137
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✦ Synopsis
Reliability and degradation behavior of lead-free solders are due to contradictions and necessary problem solving remaining aspects of further investigations. This paper shows morphologic and microstructural relationships in conjunction with mechanical properties on the intermetallic phases Ag 3 Sn and Cu 6 Sn 5 as well as (Cu, Ni) 6 Sn 5 and (Ni, Cu) 3 Sn 4 . In particular, the methods of metallographic deep-etching and the instrumented indentation hardness test were applied. The solders SnAg3,8CuX and SnCuXNi0,07 and their solder joints were comprehensively evaluated by various methods. It has been shown that alloying with nickel as a method of decreasing copper-leaching can induce embrittlement by growth of the (Cu,Ni) 6 Sn 5 phase.