𝔖 Bobbio Scriptorium

✦ LIBER ✦

Beam-leads, versatile chips with a built-in interconnection system : L. K. Keys, F. J. Francis and A. J. Russo. Proc. 21st Electronic Components Conf., Washington DC, USA, 10–12 May (1971), p. 3

Publisher: Elsevier Science
Year: 1972
Tongue: English
Weight: 111 KB
Volume: 11
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(72)90748-2

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

A new high-performance co-firable paste

A new high-performance co-firable paste system : A. H. Danis, P. J. Mangiafico and M. L. Topfer. Proc. 21st Electronic Components Conf., Washington DC, USA, 10–12 May (1971), p. 442

📂 Article 📅 1972 🏛 Elsevier Science 🌐 English ⚖ 103 KB

Production method for aluminum beam lead

Production method for aluminum beam leads on ceramic substrates : R. E. McMahon, F. J. Bachner, R. A. Cohen, W. S. Franklin and J. D. Impey. Proc. 21st Electronic Components Conf., Washington DC, USA, 10–12 May (1971), p. 96

📂 Article 📅 1972 🏛 Elsevier Science 🌐 English ⚖ 107 KB