✦ LIBER ✦
Back-to-back substrate wafer bonding: A new approach to the fabrication of double-side coated wafers
✍ Scribed by P. Kopperschmidt; G. Kästner; D. Hesse; U.M. Gösele; M. Lorenz
- Book ID
- 106023098
- Publisher
- Springer
- Year
- 1997
- Tongue
- English
- Weight
- 206 KB
- Volume
- 64
- Category
- Article
- ISSN
- 1432-0630
No coin nor oath required. For personal study only.