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Automated inspection of through hole solder joints utilizing X-ray imaging

✍ Scribed by B. Pierce; D. Shelton; H. Longbotham; S. Baddipudi; Ping Yan

Book ID: 126662088
Publisher: IEEE
Year: 1994
Tongue: English
Weight: 417 KB
Volume: 9
Category: Article
ISSN: 0885-8985
DOI: 10.1109/62.260040

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