Au/(TiW) and Au/Cr metallization of chemically vapor-deposited diamond substrates for multichip module applications

✍ Scribed by Ilango Meyyappan; A.P. Malshe; H.A. Naseem; W.D. Brown

• Publisher: Elsevier Science
• Year: 1994
• Tongue: English
• Weight: 699 KB
• Volume: 253
• Category: Article
• ISSN: 0040-6090
• DOI: 10.1016/0040-6090(94)90357-3