✦ LIBER ✦
Astronautic PBGA (plastic ball grid array) solder joints’ reliability: under successive-high acceleration shock condition
✍ Scribed by Qiang Guo; Mei Zhao; Zhen-jun Zhu; Guang Meng
- Book ID
- 105851009
- Publisher
- Springer
- Year
- 2005
- Tongue
- English
- Weight
- 837 KB
- Volume
- 27
- Category
- Article
- ISSN
- 0268-3768
No coin nor oath required. For personal study only.