Assessment and Validation of the Electrostatically Embedded Many-Body Expansion for Metal−Ligand Bonding

✍ Scribed by Hua, Duy; Leverentz, Hannah R.; Amin, Elizabeth A.; Truhlar, Donald G.

• Book ID: 127019418
• Publisher: American Chemical Society
• Year: 2010
• Tongue: English
• Weight: 564 KB
• Volume: 7
• Category: Article
• ISSN: 1549-9618
• DOI: 10.1021/ct100491q