Assessing the joints in Surface-Mounted
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Nihal Sinnadurai; Kenneth Cooper; John Woodhouse
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Article
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1986
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Elsevier Science
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English
โ 520 KB
With the advent of surface-mounting technology, an apparent problem that has received much attention is the potential failure of solder joints between microcomponents and printed circuit boards. One tequnique used to assess such joints is to subject the assemblies to thermal cycling over a wide temp