Assembly-packaging technology trends : Dan Rose. Semiconductor Int. 59 (January 1984)

• Book ID: 107829737
• Publisher: Elsevier Science
• Year: 1984
• Tongue: English
• Weight: 120 KB
• Volume: 24
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(84)90129-x