Assembly-level reliability of flex-substrate BGA, elastomer-on-flex packages and 0.5 mm pitch partial array packages

✍ Scribed by Pradeep Lall; Kingshuk Banerji

• Book ID: 108361749
• Publisher: Elsevier Science
• Year: 2000
• Tongue: English
• Weight: 926 KB
• Volume: 40
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/s0026-2714(00)00035-4