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Architectured Materials to Improve the Reliability of Power Electronics Modules: Substrate and Lead-Free Solder

✍ Scribed by Abderrahmen Kaabi, Yves Bienvenu, David Ryckelynck…

Book ID
120925704
Publisher
Springer US
Year
2013
Tongue
English
Weight
1015 KB
Volume
43
Category
Article
ISSN
0361-5235

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