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Ar+ ion recoil-implantation of Cu and Ag from the Si(111)-quasi-5 × 5-Cu and CuSi(111)-3 × 3-Ag surfaces in the keV regime

✍ Scribed by D. Ishikawa; J. Yuhara; R. Ishigami; K. Soda; K. Morita

No coin nor oath required. For personal study only.

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Dissolution and segregation of monolayer

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