✦ LIBER ✦

Approach on Thermal Strain Behaviour of PBGA Solder Joints

✍ Scribed by Ping Yang; Cai Jun Shen; Ningbo Liao

Book ID: 111200918
Publisher: John Wiley and Sons
Year: 2009
Tongue: English
Weight: 415 KB
Volume: 45
Category: Article
ISSN: 0039-2103
DOI: 10.1111/j.1475-1305.2008.00523.x

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