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Applying TLP bonding to the joining of structural intermetallic compounds

✍ Scribed by William F. Gale

Book ID: 107525080
Publisher: The Minerals, Metals & Materials Society
Year: 1999
Tongue: English
Weight: 878 KB
Volume: 51
Category: Article
ISSN: 1047-4838
DOI: 10.1007/s11837-999-0210-8

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