Applications of solid-liquid interdiffusion (SLID) bonding in integrated-circuit fabrication : L. Bernstein and H. Bartholomew, Trans. Metall. Soc. AIME, 236, March (1966), p. 405

• Publisher: Elsevier Science
• Year: 1967
• Tongue: English
• Weight: 98 KB
• Volume: 6
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(67)90218-1