Application of tape automated bonding technology to hybrid microcircuits : Dr. Rudolph, G. Oswald and William R. de Miranda. Solid St. Technol. p. 33 (March 1977)

• Book ID: 103275743
• Publisher: Elsevier Science
• Year: 1977
• Tongue: English
• Weight: 134 KB
• Volume: 16
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(77)90276-1