Application of interfacial fracture mechanics approach for obtaining design rules for flip chip interconnections

✍ Scribed by M. Dreßler; K-F. Becker; B. Wunderle; J. Auersperg; H. Reichl

• Book ID: 106185579
• Publisher: Springer-Verlag
• Year: 2008
• Tongue: English
• Weight: 458 KB
• Volume: 15
• Category: Article
• ISSN: 0946-7076
• DOI: 10.1007/s00542-008-0692-2