✦ LIBER ✦
Application of direct strain measurement of fatigue studies in surface solder joints : Yan C. Chan, D.J. Xie, J.K.L. Lai and I.K. Hui. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B, 1995, 18(4), 715
- Book ID
- 108362266
- Publisher
- Elsevier Science
- Year
- 1997
- Tongue
- English
- Weight
- 115 KB
- Volume
- 37
- Category
- Article
- ISSN
- 0026-2714
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