Analytical solution of heat conduction problem for a multilayer assembly arising in photothermal reliability testing

✍ Scribed by T. Elperin; G. Rudin

• Book ID: 103912004
• Publisher: Elsevier Science
• Year: 1994
• Tongue: English
• Weight: 327 KB
• Volume: 21
• Category: Article
• ISSN: 0735-1933
• DOI: 10.1016/0735-1933(94)90087-6