Analytical Prediction of Crosstalk Among Vias in Multilayer Printed Circuit Boards
โ Scribed by Songping Wu; Jun Fan
- Book ID
- 111876379
- Publisher
- IEEE
- Year
- 2012
- Tongue
- English
- Weight
- 661 KB
- Volume
- 54
- Category
- Article
- ISSN
- 0018-9375
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๐ SIMILAR VOLUMES
A theoretical analysis has been developed to study the crosstalk in crossed bundles of parallel lines. The model is based on the theory of the coupled transmission lines and the resulting system of differential equations has been solved by means of the finite difference, time-domain (FDTD) method. T
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