The primary aim of this paper is to describe an analytical technique which may be used in connection with the general problem of bonded wedges containing radial cracks. The technique consists of the reduction of the related dual integral equations of the problem to a singular integral equation in a
Analysis of perfectly bonded wedges and bonded wedges with an interfacial crack under antiplane shear loading
โ Scribed by A.R Shahani; S Adibnazari
- Publisher
- Elsevier Science
- Year
- 2000
- Tongue
- English
- Weight
- 188 KB
- Volume
- 37
- Category
- Article
- ISSN
- 0020-7683
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โฆ Synopsis
Antiplane shear deformation of perfectly bonded wedges as well as bonded wedges with an interface crack are studied in this paper. The solution of governing dierential equations is accomplished by means of the Mellin transform. For two edge-bonded isotropic wedges with perfect bonding along the common edge, closed form solutions are obtained for stress ยฎelds and analytical relations are given for the strength of singularity at the apex. However, for bonded wedges with an interfacial crack, ยฎrst it is necessary to express the traction-free condition of the crack faces in the form of a singular integral equation which is done in this paper by describing an exact analytical method. The resultant singular integral equations are then solved analytically and the obtained results including the stress intensity factors at the crack tips are plotted. A comparison of the results in the special cases shows a complete agreement with those cited in the literature. However, when the crack tip coincides with the wedge apex, a strength of singularity of unity has been observed.
๐ SIMILAR VOLUMES
The behaviour of a bi-piezoelectric ceramic layer with a centre interfacial crack subjected to anti-plane shear and in-plane electric loading has been studied. The dislocation density functions and the Fourier integral transform method have been employed to eliminate the problem of singular integral