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Analysis of ground-bounce induced substrate noise coupling in a low resistive bulk epitaxial process: design strategies to minimize noise effects on a mixed-signal chip

✍ Scribed by Felder, M.; Ganger, J.


Book ID
121795791
Publisher
IEEE
Year
1999
Tongue
English
Weight
162 KB
Volume
46
Category
Article
ISSN
1057-7130

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