✦ LIBER ✦
Analysis of frequency response of wire bond configurations joining two 50-Ω microstrip lines
✍ Scribed by T. Mulcahy; H. Song
- Book ID
- 102520302
- Publisher
- John Wiley and Sons
- Year
- 2010
- Tongue
- English
- Weight
- 393 KB
- Volume
- 52
- Category
- Article
- ISSN
- 0895-2477
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✦ Synopsis
Abstract
Small to medium length wirebond interconnects, which range approximately from 300 to 660 μm are investigated. Wirebond S‐parameters are measured using a parametric vector network analyzer with respect to a 50‐Ω system. Results show that there is degrading performance with increasing wirebond length and decreasing number of bonds. © 2009 Wiley Periodicals, Inc. Microwave Opt Technol Lett 52: 487–490, 2010; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.24919