Analysis of electromigration induced early failures in Cu interconnects for 45 nm node

✍ Scribed by L. Arnaud; F. Cacho; L. Doyen; F. Terrier; D. Galpin; C. Monget

• Publisher: Elsevier Science
• Year: 2010
• Tongue: English
• Weight: 875 KB
• Volume: 87
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/j.mee.2009.06.014