Analysis of die profiles in wire drawing
โ Scribed by L.W. Hu
- Publisher
- Elsevier Science
- Year
- 1957
- Tongue
- English
- Weight
- 673 KB
- Volume
- 263
- Category
- Article
- ISSN
- 0016-0032
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โฆ Synopsis
A method for the stress analysis of wire drawing using dies of any given profile is described.
Examples of straight, concave, convex and bell-shape dies are investigated. Results indicate that the die profile has a significant effect on the distribution of die pressure and comparison shows that the bell-shape die has the lowest draw stress and the most uniformly distributed pressure and frictional force.
๐ SIMILAR VOLUMES
A model is proposed to describe crack formation (referred to as wire splitting) that can occur during wire drawing of commercial tungsten lamp wire. In the proposed model, wire splitting is said to occur in response to residual tensile hoop stresses that are generated during wire drawing. The resist