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Analysis of cracked plates with a bonded patch

โœ Scribed by Tarn Jiann-Quo; Shek Kam-Lun


Publisher
Elsevier Science
Year
1991
Tongue
English
Weight
765 KB
Volume
40
Category
Article
ISSN
0013-7944

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โœฆ Synopsis


AMraet-The problem of a hacked plate repaired by an adhesively bonded patch is studied. A shear spring model is adopted to reduce the problem to the analysis of a cracked plate and a patch subjected to external loads and interacting adhesive shear. While the patch is treated by the i?nite element method, the cracked plate is analyzed by the boundary element method, in which a special fundamental solution satisfying the boundary condition on the crack surface is introduced. The present formulation provides comparable results on the stress intensity factor of the patched crack with less computational effort.


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