✦ LIBER ✦
Analysis of bonding problems under thermal loading using the combined mixed functional
✍ Scribed by Donc Seok Kim; Byung Chai Lee
- Publisher
- Elsevier Science
- Year
- 1994
- Tongue
- English
- Weight
- 923 KB
- Volume
- 31
- Category
- Article
- ISSN
- 0020-7683
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