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Analysis of bonded piezoelectric materials with a crack perpendicular to the interface subjected to in-plane loading

✍ Scribed by Sheng-Hu Ding; Xing Li; Li-Fang Guo

Book ID: 116375532
Publisher: Elsevier Science
Year: 2010
Tongue: English
Weight: 608 KB
Volume: 47
Category: Article
ISSN: 0927-0256
DOI: 10.1016/j.commatsci.2009.11.033

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