Analysis of Barrier Defects in Low-k/Cu Interconnects Based on Electrochemical Response and Simulation Cell

✍ Scribed by Dong Mei Meng; Nancy L. Michael; Young-Joon Park; Choong-Un Kim

• Book ID: 107455057
• Publisher: Springer US
• Year: 2007
• Tongue: English
• Weight: 895 KB
• Volume: 37
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-007-0323-1