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Analysis and simulation of multiconductor transmission lines for high-speed interconnect and package design

✍ Scribed by You, H.; Soma, M.


Book ID
117872772
Publisher
IEEE
Year
1990
Tongue
English
Weight
567 KB
Volume
13
Category
Article
ISSN
0148-6411

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## Abstract A novel transmission‐line model of high‐speed IC interconnects is presented based on the linear multistep integral method (LMIM), which has the same form as the RLC circuit equation. Using this method, one can expediently analyze the time response of interconnection networks by the orde