✦ LIBER ✦
Analysis and experimental verification of the competing degradation mechanisms for solder joints under electron current stressing
✍ Scribed by J.H. Ke; T.L. Yang; Y.S. Lai; C.R. Kao
- Book ID
- 108049217
- Publisher
- Elsevier Science
- Year
- 2011
- Tongue
- English
- Weight
- 834 KB
- Volume
- 59
- Category
- Article
- ISSN
- 1359-6454
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