Thermal stability analysis of conduction
โ
T. Obana; K. Tasaki; T. Kuriyama; T. Okamura
๐
Article
๐
2003
๐
Elsevier Science
๐
English
โ 456 KB
Thermal stability of a conduction-cooled Bi-2223/Ag pancake coil has been investigated by means of a time dependent numerical analysis. The coil is cooled by a cryocooler through a cooling plate. This study focused on the temperature profile in the coil and the thermal runaway current. It is suggest