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Analysis and development of a thermocompression bond schedule for beam lead devices : J. R. Adams and H. B. Bonham. IEEE Trans. Parts, Hybrids Packng PHP-8, No. 3, September (1972), p. 22


Publisher
Elsevier Science
Year
1973
Tongue
English
Weight
110 KB
Volume
12
Category
Article
ISSN
0026-2714

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