✦ LIBER ✦
An overview of Pb-free, flip-chip wafer-bumping technologies
✍ Scribed by Sung K. Kang; Peter Gruber; Da-Yuan Shih
- Book ID
- 107523303
- Publisher
- The Minerals, Metals & Materials Society
- Year
- 2008
- Tongue
- English
- Weight
- 697 KB
- Volume
- 60
- Category
- Article
- ISSN
- 1047-4838
No coin nor oath required. For personal study only.