An investigation of void formation on a bonded interface of power law creep materials containing a cylindrical particle

✍ Scribed by Y. S. Lee; T. J. Batt

• Book ID: 112494683
• Publisher: Springer Vienna
• Year: 1989
• Tongue: English
• Weight: 1001 KB
• Volume: 79
• Category: Article
• ISSN: 0001-5970
• DOI: 10.1007/bf01187262