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An integrated environment for technology closure of deep-submicron IC designs

✍ Scribed by Trevillyan, L.; Kung, D.; Puri, R.; Reddy, L.N.; Kazda, M.A.


Book ID
121863950
Publisher
IEEE
Year
2004
Tongue
English
Weight
334 KB
Volume
21
Category
Article
ISSN
0740-7475

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