✦ LIBER ✦
An improved numerical method for predicting intermetallic layer thickness developed during the formation of solder joints on Cu substrates
✍ Scribed by S. Chada; W. Laub; R. A. Fournelle; D. Shangguan
- Book ID
- 107457962
- Publisher
- Springer US
- Year
- 1999
- Tongue
- English
- Weight
- 224 KB
- Volume
- 28
- Category
- Article
- ISSN
- 0361-5235
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