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An experimental procedure for characterizing interconnects to the DC power bus on a multilayer printed circuit board

✍ Scribed by Shi, H.; Fei Sha; Drewniak, J.L.; Van Doren, T.P.; Hubing, T.H.


Book ID
114534042
Publisher
IEEE
Year
1997
Tongue
English
Weight
242 KB
Volume
39
Category
Article
ISSN
0018-9375

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