✦ LIBER ✦
An experimental model of the microelectronic ultrasonic wire bonding mechanism : G. G. Harman and K. O. Leedy. 10th IEEE Annual Proceedings, Reliability Physics (1972), p. 49
- Publisher
- Elsevier Science
- Year
- 1973
- Tongue
- English
- Weight
- 109 KB
- Volume
- 12
- Category
- Article
- ISSN
- 0026-2714
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