An analytical singular element for interface cracks in bi-material Kirchhoff plate bending
โ Scribed by Weian Yao; Shan Wang
- Book ID
- 116446725
- Publisher
- Elsevier Science
- Year
- 2012
- Tongue
- English
- Weight
- 678 KB
- Volume
- 91
- Category
- Article
- ISSN
- 0013-7944
No coin nor oath required. For personal study only.
๐ SIMILAR VOLUMES
In this paper an effective numerical method is presented for analyzing the stress intensity factors associated with the stress field near a partially debonded interface in a finite bi-material plate. The stress functions are assumed such that they can represent the stress singularity at the crack ti
On the basis of general solutions of two-dimensional linear elasticity, displacement and singular stress fields near the singular point in orthotropic materials are derived in closed form expressions. According to the presented expressions, analysis formulas of displacement and singular stress field