✦ LIBER ✦
An aluminum-germanium eutectic structure for silicon wafer bonding technology
✍ Scribed by I. Perez-Quintana; G. Ottaviani; R. Tonini; L. Felisari; M. Garavaglia; L. Oggioni; D. Morin
- Publisher
- John Wiley and Sons
- Year
- 2005
- Tongue
- English
- Weight
- 149 KB
- Volume
- 2
- Category
- Article
- ISSN
- 1862-6351
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